Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part silver conductive epoxy systems, the EP21TDCSMed has a one-to-one mix ratio, by weight or volume. It readily develops a high bonding strength of more than 1800 psi tensile shear and a T-peel of greater than 20 pli when measured and cured at 75°F. It is 100% reactive and does not contain any diluents or solvents. The volume resistivity of the cured system is less than 10-3 ohm-cm. Master Bond Polymer System EP21TDCSMed can be applied with minimal sagging or dripping even on vertical surfaces although it can be made thinner (flowable) by adding 5 to 10% of an appropriate solvent (xylene, acetone, MEK, etc.) by weight. The high strength bonds are remarkably adaptable to thermal cycling and resistant to chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of 4K to +275°F enabling it to be serviceable even in cryogenic applications. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Parts A and B are both colored silver. Master Bond EP21TDCSMed is widely used in medical electronic applications where biocompatibility issues are of paramount importance, e.g. implants. For convenient handling, EP21TDCSMed is also available in premixed and frozen syringes.