Master Bond Polymer System EP30HV is a low viscosity, two component epoxy system for high performance bonding, sealing, coating and casting. It is formulated to cure at room temperature or more rapidly at elevated temperatures. It has an easy to use, non-critical 4 to 1 mix ratio by weight. This system is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended when low viscosity, excellent physical strength properties along with optical clarity are required. The linear shrinkage after cure is exceptionally low, about 0.0003 inches/inch. The combination of superb physical properties and convenient processing enable EP30HV to be used not only for bonding and coating, but also for potting and encapsulation, especially of electronic or optical assemblies. Master Bond Polymer System EP30HV produces high strength, rigid bonds which are remarkably resistant to chemicals including water, oils, acids, bases and many organic solvents. The temperature range is -60°F to 300°F. It adheres well to a wide variety of materials including metals, glass, ceramics, wood, rubbers and many plastics. The cured epoxy has excellent electrical and thermal insulation properties along with outstanding light transmittance from 350 to about 2400nm. Master Bond Polymer System EP30HV is widely used in the electronic, electrical, computer, aerospace, optical, fiber optic, medical, automotive and chemical industries.