Master Bond Polymer System UV22 represents a remarkable technological breakthrough in the utilization of nanotechnology in the formulation of a one component UV curable epoxy for coating, sealing, and encapsulation applications. This nanosilica filled system features outstanding physical strength properties, superb abrasion resistance, excellent optical clarity along with exceptionally low shrinkage. The performance properties of UV22 surpass those of similar unreinforced systems by an amazing 50-90%. The silica phase comprises surface modified synthetic silica nanospheres of very small size (<50nm) and with a very narrow particle size distribution. Despite the relatively high percentage of nano particles (>35%) added to the UV22, it still retains high transparency and low viscosity without sedimentation due to the agglomerate-free colloidal dispersion of the reinforcing nanoparticles in the resin. UV22 cures rapidly using light sources emitting a wavelength with 250-365nm with an energy output of as little as 20-40 milliwatts/cm² with higher outputs facilitating a faster cure. The shrinkage upon cure is less than 2%. UV22 can be used over the wide temperature range of -60 to 300°F and will cure in thicknesses up to 1/8th of an inch. Additionally, UV22 has excellent electrical insulation properties. Higher viscosity versions of UV22 are also available. Unlike many other UV curable products, UV22 is not oxygen inhibited and exhibits a fast cure at ambient temperatures, even in the presence of air. Post curing the UV22 enhances its temperature resistance profile. Adding heat (90-125°C for 30 minutes) will give it a glass transition temperature of 135°C, far higher than traditional UV systems. The post cure is also effective in increasing its chemical resistance to solvents, acids and bases.