Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M has a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi tensile shear when measured and cured at 75°F. It is 100% reactive and does not contain any diluents or solvents. The volume resistivity of the cured system is 5-10 ohm-cm. Master Bond Polymer System EP76M can be applied with minimal sagging or dripping even on vertical surfaces, although it can be made thinner (flowable) by adding 5 to 10% of an appropriate solvent (xylene, acetone, MEK, etc.) by weight. The high strength bonds are remarkably adaptable to thermal cycling and resistant to chemicals including water, oil and most organic solvents over the exceptionally wide temperature range of -60°F to more than +250°F. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Parts A and B are both colored gray. Master Bond EP76M adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance and automotive industries among others. There are also are a number of specialized versions of EP76M available. These include EP76 which meets certain military specs, EP76M-F which is a fast curing version (5-10 minute set up time), and EP76MHT which is a high temperature resistant version (serviceable up to 400°F).