Industrial Sealants from Master Bond, Inc.
Epoxy Adhesive with Low Coefficient of Thermal Expansion -- EP42HT-2LTE
Featuring an exceedingly low coefficient of thermal expansion of 9-12 x 10-6 in/in/°C, EP42HT-2LTE is a two component epoxy for bonding, sealing, coating and select casting applications. It has outstanding dimensional stability and will bond well to a wide variety of substrates, including metals, composites, ceramics, glass and many plastics. It is also noteworthy for its low linear (less than 0.01%) and volumetric (less than 0.1%) shrinkage. EP42HT-2LTE has a forgiving, non-critical mix ratio of 100 to 50 by volume and after mixing the consistency is that of a paste with some flow.
Specifications
Product Category
Industrial Sealants
Chemical System
Epoxy
Composition
Unfilled
Cure / Technology
Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Features
High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
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