Industrial Sealants from Master Bond, Inc.

Epoxy Adhesive with Low Coefficient of Thermal Expansion -- EP42HT-2LTE

 
 
Epoxy Adhesive with Low Coefficient of Thermal Expansion -- EP42HT-2LTE -- View Larger Image
Epoxy Adhesive with Low Coefficient of Thermal Expansion -- EP42HT-2LTE-Image

Specifications

Product Category
Industrial Sealants
Chemical System
Epoxy
Composition
Unfilled
Cure / Technology
Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Features
High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
Industry
 
Use Temperature
 
CTE
 
Tensile (Break)
 
Dielectric Strength
 
Dielectric Constant