Industrial Sealants from Master Bond, Inc.

Thermally Conductive Epoxy Polysulfide Adhesive -- EP21TPFL-1AO

 
 
Thermally Conductive Epoxy Polysulfide Adhesive -- EP21TPFL-1AO -- View Larger Image
Thermally Conductive Epoxy Polysulfide Adhesive -- EP21TPFL-1AO-Image

Specifications

Product Category
Industrial Sealants
Chemical System
Polyphenylene Sulfide; Epoxy
Composition
Unfilled
Cure / Technology
Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form
Liquid
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Features
 
Industry
 
Use Temperature
 
Thermal Conductivity
 
CTE
 
Tensile (Break)
 
Elongation
 
Dielectric Constant