Industrial Sealants from Master Bond, Inc.

Room Temperature Curing Epoxy System -- EP21

 
 
Room Temperature Curing Epoxy System -- EP21 -- View Larger Image
Room Temperature Curing Epoxy System -- EP21-Image

Specifications

Product Category
Industrial Sealants
Chemical System
Epoxy
Cure / Technology
Thermoset; Two Component  
Type / Form
Liquid
Substrate Compatibility
Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
Features
Encapsulant, Potting Compound; Flexible; Gap Filler, Foam in Place Gasket
Industry
 
Viscosity
 
Use Temperature
 
Thermal Conductivity
 
CTE
 
Tensile (Break)
 
Elongation
 
Dielectric Strength
 
Dielectric Constant