Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is also able to withstand cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period). This optically clear, low viscosity cryogenic epoxy bonds well to a wide variety of substrates including metals, glass, ceramics, and many different plastics. The working life is long; a 100 gram mass will allow over 90-120 minutes of working life. The EP29LPSP has superior electrical insulation properties and a good chemical resistance profile. EP29LPSP requires gelling the mixed epoxy at room temperature for 1 to 2 hrs followed by alternative lower elevated temperature cure cycles (8-10 hrs @ 130°F to 150°F) or (5-7 hrs @ 175°F) or (3-5 hrs @ 200°F). A thermally conductive version called EP29LPSPAO is also available.