GAP PAD™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly. GAP PAD™ HC 5.0 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.
GAP PAD™ HC 5.0 is offered with natural inherent tack on both sides of the material, eliminating the need for thermallyimpeding adhesive layers. The top side has minimal tack for ease of handling. GAP PAD™ HC 5.0 is supplied with protective liners on both sides.
Highly Conformable, Thermally Conductive, Low Modulus Material
Features And Benefits
- Thermal Conductivity: 5.0 W/m-K
- High-compliance, low compression stress
- Fiberglass reinforced for shear and tear resistance
Typical Applications Include
- ASICs and DSPs
- Consumer electronics
- Thermal modules to heat sinks