EPO-TEK® TD1001 is a thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging.
EPO-TEK® TD1001 Advantages & Application Notes:
- Low Tg, several weeks of pot-life and low modulus are a few of its traits.
- It is particularly suitable for bonding ferrite cores in power device plastic packaging.
- Excellent adhesion to PCBs, ceramics, most metals and lead frames.
- Suggested Applications: Semiconductor, Electronics, Optics