Master Bond, Inc. Datasheets for EMI and RFI Shielding

EMI and RFI shielding includes coatings, gaskets, enclosures, sealants, resins and other products or materials that block out electromagnetic interference (EMI) and radio frequency (RF) interference.
EMI and RFI Shielding: Learn more

Product Name Notes
Two Component Thermally Conductive Epoxy System -- EP21TDCANHT EP21TDCANHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally...
Two Component Thermally Conductive Epoxy -- EP21TDCAOHT EP21TDCAOHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally...
Flexible, Electrically Conductive Two Component Epoxy -- EP79FL EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity...
Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications -- EP21TDCN-LO Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and...
Two Part, NASA Low Outgassing, Nickel Conductive Epoxy -- EP21TDCN-LO Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system...
Quartz Filled Chemical Resistant Two Component Epoxy -- Supreme 45HTQ Featuring exceptional abrasion and chemical resistance, Supreme 45HTQ is a two component, quartz filled epoxy system for bonding, sealing and casting applications. It effectively withstands exposure to petrochemicals, acids, bases...
One Component, Electrically Conductive Coating System -- MB600G Ideal for electromagnetic interference (EMI) and radio frequency interference (RFI) shielding applications, MB600G is an aqueous based, sodium silicate system with a graphite filler. Electrically conductive, graphite filled materials are...
Two Component, Epoxy Resin Systems -- EP21LSCL-1 Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of...
Low Viscosity Heat Resistant Epoxy System -- EP34CA Master Bond EP34CA is a low viscosity, polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures, potting and casting applications. When used in conjunction with various...
One Component Liquid Epoxy Resin EP36CLV -- EP36CLV Master Bond EP36CLV is a unique one component, high performance epoxy for bonding, sealing, potting and coating featuring electrical insulation, high temperature resistance and exceptionally low viscosity. It varies appreciably...
One Part, NASA Low Outgassing Electrically Conductive Epoxy -- EP3HTS-LO Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for...
Silver Filled, Electrically Conductive Adhesive Film -- FL901S Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration...
Silver Conductive, One Part Aqueous Based Sodium Silicate System Available for EMI/RFI Shielding -- MB600S Master Bond MB600S is an aqueous based sodium silicate coating formulated for applications where electromagnetic interference/radio frequency interference (EMI/RFI) shielding is required. Tested according to IEEE 299, 2006 methods, MB600S...
Thermally Conductive Room temperature Curing Epoxy -- EP21AN Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has...
Two Component, Thermally Conductive -- EP21ANHT Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. EP21ANHT is...
Toughened, Shock Resistant, Two Component Epoxy -- EP21TDC Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one...
Room Temperature Curing, Toughened Two Part Epoxy -- EP21TDCHT Master Bond Polymer Adhesive EP21TDCHT is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one...
Non-Drip, Polysulfide Based Two Component Adhesive -- EP21TPND-NV Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100...
USP Class VI Certified, Two Component Epoxy -- EP30Med Master Bond Polymer Adhesive EP30Med is a two component very low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily...
Two Component, Non-Drip Consistency Epoxy System -- EP30ND Master Bond Polymer Adhesive EP30ND is a high viscosity, two component epoxy adhesive for general purpose bonding and repair formulated to cure at room temperature or more rapidly at elevated...
High Tempreature and Thermal Cycling Resistant Epoxy -- EP33 Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more...
Room Temperature Curing, Two Component Epoxy -- EP33LV Master Bond Polymer Adhesive EP33LV is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more...
Fast Curing, High Bond Strength Epoxy Adhesive -- EP51 Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio...
Fast Curing, Thermal Cycling Resistant Epoxy Adhesive -- EP51M Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio...
Two Component, Fast Curing Epoxy Adhesive -- EP65 Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly...
Radiopaque Two Component Epoxy Compound -- EP21BAS Master Bond Polymer System EP21BAS is a radioopaque two component epoxy compound which cures readily at ambient or more quickly at elevated temperatures. This epoxy polymer system features outstanding physical...
Two Component Polymer System -- EP21CLV
Two Component Polymer System -- EP21CLV
Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures,...
Two Component, Room Temperature Curing Epoxy -- EP21ND Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, a very forgiving 1 to 1 mix ratio by weight or volume...
Thermally Conductive, Heat Resistant Epoxy -- EP21TCHT-1 Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100/60...
Two Component Epoxy with Outstanding Flexibility -- EP21TDC-2 Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient...
Two Component, Thermally Conductive Epoxy -- EP21TDC-2AN Master Bond Polymer System EP21TDC-2AN is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient...
Two Component Highly Flexibilized Epoxy -- EP21TDC-2AO Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient...
Two Component, Thermally Conductive Epoxy -- EP21TDC-2LO Master Bond Polymer System EP21TDC-2LO is a low outgassing two component highly flexible, thermally conductive epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to...
Two Component, Highly Flexibilized Epoxy for Bonding, Sealing and Coating -- EP21TDC-4
Two Component, Highly Flexible Epoxy -- EP21TDC-4
Master Bond Polymer System EP21TDC-4 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or...
Two Component, Toughened Epoxy Compound -- EP21TDC-4HT Master Bond Polymer System EP21TDC-4HT is a unique two component, toughened epoxy compound for high performance bonding, sealing and casting featuring high peel strength, superior resistance to vibration, impact and...
Highly Flexible Two Part Epoxy -- EP21TDC-7
Highly Flexible Two Part Epoxy -- EP21TDC-7
Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or...
Two Component, Nickel Conductive Epoxy Adhesive -- EP21TDCN Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures.
Two Component Nickel Conductive Epoxy Adhesive -- EP21TDCNFL Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Silver Filled, Electrically Conductive Epoxy -- EP21TDCS Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Two Component, Silver Conductive Epoxy Adhesive -- EP21TDCS-LO Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at...
Medical Grade, Silver Conductive Epoxy Compound -- EP21TDCSMed Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room...
Aluminum Filled, Toughened, Two Part Epoxy Compound -- EP22 Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more...
Low Exotherm, Two Component Epoxy -- EP29LP Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will...
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function...
High Shear/Peel Strength, Room Temperature Curing Epoxy -- EP31 Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many...
Room Temperature Curing, Two Component Epoxy System -- EP34 Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature...
Two Component, Room Temperature Curing Epoxy -- EP34AN Master Bond Polymer System EP34AN is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where very high thermal conductivity is required. It...
Two Component, Room Temperature Curing Epoxy -- EP34AO Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity is required. It is formulated...
One Component, High Temperature Resistant Epoxy -- EP36 Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination...
One Part, Thermally Conductive, Heat Resistant Epoxy -- EP36AO Master Bond Polymer System EP36AO is a truly unique one component high performance flexibilized epoxy system for electrical potting and encapsulation, baked coatings and adhesive applications. It features an outstanding...
Two Component, Heat Resistant Epoxy -- EP46HT-1 Master Bond Polymer System EP46HT-1 is a two component epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures from -100°F to +550°F is...
Two Part, Rapid Curing, Cryogenic Epoxy -- EP51FL-1 Master Bond Polymer System EP51FL-1 is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very slow curing,...
Fast Curing, High Temperature Resistant Epoxy -- EP65HT Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting...
Fast Curing High Glass Transition Temperature Epoxy -- EP65HT-1 Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting...
Graphite Filled, Electrically Conductive Epoxy -- EP75-1 Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly...
Nickel Filled Electrically Conductive Epoxy System -- EP76M Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly...
Two Component, Silver Coated, Nickel Filled Epoxy -- EP79 Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more...
Heat Curing. Snap Cure Epoxy Supreme -- Supreme 10HTF-1 Master Bond Polymer System Supreme 10HTF-1 is a one-part/no-mix system featuring a unique combination of properties including high shear and peel strength, exceptionally wide service temperature range and very rapid...
Flexibilized Epoxy System -- Supreme 10HTFL Master Bond Polymer System Supreme 10HTFL features a unique blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4K to...
Toughened Epoxy Adhesive/Sealant Supreme -- Supreme 10HTCL Master Bond Supreme 10HTCL features a unique blend of performance properties including both high shear and peel strengths along with convenient handling. This one component system is formulated to cure...
Two Component, High Performance Epoxy -- EP46HT Master Bond System EP46HT is a newly formulated two component high performance heat resistant epoxy resin system with excellent mechanical strength and chemically resistant properties for structural bonding, sealing and...
NASA Low Outgassing Approved, One Component Epoxy -- EP17HT-LO Passing ASTM E595 testing for NASA low outgassing, EP17HT-LO is widely used in a variety of applications in the aerospace, oil/chemical processing, optical, opto-electronic and specialty OEM industries. This single...