KLA-Tencor’s eDR-52xx wafer defect review systems capture high resolution images of wafer defects detected by inspection tools. These images enable defect classification, helping chipmakers to identify systematic defect sources and resolve yield issues. The latest addition to the eDR-52xx series, the eDR-5210S e-beam wafer defect review system, introduces reticle defect review (RDR) and critical point inspection (CPI) modes, furthering the platform’s ability to identify systematic defects from various sources. The eDR-5210S also features improvements to its automated bare wafer (ABW) defect review mode.