The dual-beam FIB-SEM integrates a high-performance 40 kV FIB column and an ultra-high-resolution Schottky field-emission SEM column. By using dedicated fabrication template patterns for automatic lift-out, fabrication processes from fiducial marking to specimen lift-out can be automated. For lamella thinning, the fabrication process from rough milling to fine-finish milling can be automatically executed. The Mill and Monitor function allows for observation and capture of sliced images for 3D image reconstruction and for internal structural analysis. A variety of holders are available including those that are application specific, and their compatibility with Hitachi TEM/SEM products realizes high throughput and ease of use.