Polymers and Plastic Resins from Master Bond, Inc.

Epoxy Has Low Thermal Expansion Coefficient -- EP30LTE-LO

 
 
Epoxy  Has Low Thermal Expansion Coefficient -- EP30LTE-LO -- View Larger Image
Epoxy  Has Low Thermal Expansion Coefficient -- EP30LTE-LO-Image

Specifications

Product Category
Polymers and Plastic Resins
Type
CastingResin; Optical; Thermally cured
Chemical System
Epoxy
Form / Shape
Liquid
Industry
Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
Use Temperature
-60 to 250 F (-51 to 121 C)
Thermal Conductivity
 
CTE
 
Tensile Modulus
 
Resistivity
 
Dielectric Strength
 
Dielectric Constant
 
Index of Refraction
 
Water Absorption
 
Viscosity