Polymers and Plastic Resins from Epoxy Technology
Silver-filled Epoxy System -- EPO-TEK® H20E-8
EPO-TEK® H20E-8 is a silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscosity and higher thixotropic version of EPO-TEK® H20E.
Specifications
Product Category
Polymers and Plastic Resins
Type
CastingResin; Thermally cured
Chemical System
Epoxy
Filler
Metal or MIM
Form / Shape
Liquid
Industry
Electronics; Electrical Power or High Voltage
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