EPO-TEK® 302 is a fast-gelling, room temperature curing epoxy, designed for electronic, optical, and general applications.
EPO-TEK® 302 Advantages & Application Notes:
• Due to its versatility, it may be used to adhere, seal, pot or encapsulate.
• Allows for % transmission in VIS and NIR range. It can be used as an adhesive in the optical pathway of light.
• Convenient and easy to use 1:1 mix ratio allows for hand, meter mix, or specialty packaging.
• Suggested applications:
o Field Assembly: mix and cure in the field. Fast gelling and curing in 2-3 hours is accomplished.
o Electronics: rapid prototyping of parts with fast curing epoxy – no need for oven cycle times.
o Optics: active alignment of optics such as lenses, prisms, diodes, filters, etc. to opto-circuit.
o Fiber Optics: “field curing” or field assembly of connectors and couplers; also suggested for fiber optic splicing.
o General: arts and crafts repair, restoration, and hobbyists.