Polymers and Plastic Resins from Epoxy Technology

Epoxy Designed For Semiconductor Die-attach -- EPO-TEK® H20E-175

 
 
Epoxy Designed For Semiconductor Die-attach -- EPO-TEK® H20E-175 -- View Larger Image
Epoxy Designed For Semiconductor Die-attach -- EPO-TEK® H20E-175-Image

Specifications

Product Category
Polymers and Plastic Resins
Type
CastingResin; Thermally cured
Chemical System
Epoxy
Filler
Unfilled
Form / Shape
Liquid
Industry
Electronics; Electrical Power or High Voltage; Semiconductors or IC Packaging
Features
 
Use Temperature
 
Thermal Conductivity
 
CTE
 
Viscosity