Materion Microelectronics and Services can provide thick film metallized BeO and alumina (Al2O3) substrates. The refractory metal paste MoMn is screen printed onto the substrate, fired, and then plated with Ni and Au. This classic metallization provides the highest levels of adhesive strength between the thick film and ceramic substrate. The Ni plating provides a surface that is compatible with brazing (e.g., with CuAg eutectic braze) or subsequent plating. A gold plating atop the Ni provides a surface compatible with Au or Al wire bonding, and die attach with AuSi or AuSn.