Industrial Adhesives from RS Components, Ltd.

1181368


 
 
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A heat curable, one part thixotropic adhesive for use in holding components in place during soldering operations of surface mount assemblies.
High uncured green strength and fast cure cycle with medium bond strength. Thixotropic properties give high dot profile. Excellent mechanical strength. Not affected by UV light. Resistant to PCB cleaning solvents. Medium strength cure allows component removal for rework. Hardness (shore) 85. Dielectric constant 3.5 @ 1 kHz
Type = Thermal Conductive Adhesive
Product Material = Epoxy
Package Type = Syringe
Package Size = 10 ml
Thermal Conductivity = 0.25 - 0.3W/m°C
Cure Time = 30 (90 °C) min, 4 (120 °C) min
Maximum Operating Temperature = +130°C
Minimum Operating Temperature = -40°C
Operating Temperature Range = -40 - +130 °C


Specifications

Product Category
Industrial Adhesives
Features
Thermally Conductive
Use Temperature
 
Thermal Conductivity
 
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