Industrial Adhesives from Master Bond, Inc.

Underfill Epoxy Offers Thermal Conductivity And Electrical Insulation -- EP29LPTCHT

Underfill Epoxy Offers Thermal Conductivity And Electrical Insulation -- EP29LPTCHT -- View Larger Image
Underfill Epoxy Offers Thermal Conductivity And Electrical Insulation -- EP29LPTCHT-Image

Specifications

Product Category
Industrial Adhesives
Chemical System
Epoxy
Cure / Technology
Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form
Liquid
Features
High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Thermally Conductive
Substrate Compatibility
Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Industry
 
Gap Fill
 
Use Temperature
 
Thermal Conductivity
 
CTE
 
Tensile (Break)
 
Dielectric Constant