Master Bond Polymer System EP30C is a new, versatile two component nickel modified polymer system featuring high electrical conductivity, superior bonding strength and chemical resistance for EMI/RFI shielding as well as bonding and sealing applications. This electrically highly conductive compound uniquely combines the recognized advantageous performance characteristics of epoxy resins such as strength, chemical resistance and adhesive qualities and also offers desirable toughness, abrasion resistance and durability. Master Bond Polymer System EP30C is formulated to cure at room temperature or more rapidly at elevated temperatures with a convenient one hundred-to-one (100:5) mix ratio by weight. The EP30C system cures with minimal shrinkage to an electrically conductive, high strength and tough elastomer compound with remarkably good resistance to thermal cycling and chemicals including water, inorganic salts, alkalis and acids as well as many organic chemicals over the exceptionally wide temperature range of -60°F to more than 250°F. It is 100% reactive and does not contain any solvents or diluents. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The cured electrically conductive polymer has high dimensional stability. Master Bond Polymer System EP30C is widely used for EMI/RFI shielding as well as bonding, sealing and encapsulation applications where high electrical conductivity is required.