BERGQUIST SIL PAD TSP K900, The Original, Thermally Conductive, Polyimide-Based Insulator
BERGQUIST® SIL PAD® TSP K900 uses a specially developed film which has high thermal conductivity, high dielectric strength and is very durable. BERGQUIST SIL PAD TSP K900 combines the thermal transfer properties of well-known Sil-Pad rubber with the physical properties of a film. BERGQUIST SIL PAD TSP K900 is a durable insulator that withstands high voltages and requires no thermal grease to transfer heat. BERGQUIST SIL PAD TSP K900 is available in customized shapes and sizes.
Options and Configurations
Configuration - 12" x 12" sheets, 12" x 250 rolls or custom configuration
Adhesive - Adhesive one side, no adhesive
Standard thickness - 0.006"
Custom made configurations available upon request
- Thermal impedance: 0.48°C-in2/W (@50 psi)
- Withstands high voltages
- High dielectric strength
- Very durable
- Less sensitive to clamping pressure because of its smooth surface finish