BERGQUIST GAP PAD TGP 3000M, 3 W/m-K, Low Modulus Gap Pad with exceptional thermal performance at low pressures
BERGQUIST® GAP PAD TGP 3000M is a soft gap filling material specially formulated for use on applications requiring low assembly stress. It is highly conformable to rough or irregular surfaces, allowing excellent wet-out at the interface. The inherent tack on both sides of the material eliminates the need for thermally impeding adhesive layers and allows for stick-in-place characteristics during assembly. Protective liners are supplied on both sides allowing for ease of use.
- Thermal Conductivity: 3.0 W/m-K
- High-compliance, low compression stress