BERGQUIST GAP PAD TGP 3500ULM, Highly Conformable, Thermally Conductive, Ultra-Low Modulus, Fiberglass Reinforced, Silicone Based Pad BERGQUIST® GAP PAD TGP 3500ULM (ultra low-modulus) is an extremely soft gap filling material rated at a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.5 W/m-K filler package and ultra-low modulus resin formulation. The enhanced material is well suited for high performance applications requiring extremely low assembly stress. BERGQUIST GAP PAD TGP 3500ULM maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. BERGQUIST GAP PAD TGP 3500ULM is offered with and without fiberglass and has higher natural inherent tack on one side of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. BERGQUIST GAP PAD TGP 3500ULM is supplied with protective liners on both sides.

• Thermal conductivity: 3.5 W/m-k
• Highly conformable and maintains structure integrity with extremely low compression stress
• Fiberglass reinforced for puncture, shear and tear resistance
• Non-fiberglass option for reduced stress required in application