LOCTITE ABLESTIK 2600K, Thermal Management, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 2600K adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses a unique suspension system containing silver, thermoplastic and thermoset resin particles suspended in a solvent carrier. Once the material is fully cured and the solvent is evaporated, the adhesive has an extremely high silver loading. LOCTITE ABLESTIK 2600K adhesive provides very low thermal resistance between chip to case, nearing solder and eutectic-type materials.

• High thermal conductivity
• Good dispensability
• Thin bondline
• Low moisture uptake
• Low extractable ionics
• Wire bondable at 250ºC
• Low stress
• Excellent anti-delamination properties
• Yields consistent dot sizes with minimal or no tailing