LOCTITE ABLESTIK SSP 2020, Silver Sintering Paste, High power die attach LOCTITE® ABLESTIK SSP 2020 sintering silver paste die attach adhesive designed for devices requiring high thermal and electrical conductivity. LOCTITE ABLESTIK SSP 2020 is formulated to provide high heat transfer generated from power devices. LOCTITE ABLESTIK SSP 2020 maintains high adhesion at operating temperatures as high as 260ºC.

• Long work life
• Good workability
• Syringe dispensable
• Stencil printable
• High electrical conductivity
• High thermal conductivity
• High die shear strength