LOCTITE ABLESTIK ABP 8064T, Hybrid chemistry, Die Attach LOCTITE® ABLESTIK ABP 8064T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes.

• High thermal conductivity
• High electrical conductivity
• Medium modulus
• Low outgassing
• Stable at high temperatures
• Good reliability performance
• Soft solder replacement
• Use for wide range of package sizes