BERGQUIST LIQUI BOND TLB EA1800, Thermally Conductive, Two-Part, Epoxy Based, Liquid-dispensable Adhesive BERGQUIST® LIQUI BOND TLB EA1800 is a two-component, epoxy based, liquid-dispensable adhesive. BERGQUIST LIQUI BOND TLB EA1800 has a thermal conductivity of 1.8 W/mK. BERGQUIST LIQUI-BOND EA 1805 will be supplied in a two-component format, and refrigeration is not required. BERGQUIST LIQUI BOND TLB EA1800 has a high bond strength with room temperature cure that can be accelerated with additional heat. The high bond strength eliminates the need for fasteners and maintains structural bond in severe environments. Recommended usage is filling any surface irregularities between heat sources and heat spreaders of similar CTE. BERGQUIST LIQUI BOND TLB EA1800 is thixotropic and will remain in place during dispensing, and the material will flow easily under minimal pressure resulting in thin bondlines and very low stress placed on fragile components during assembly

• Room temperature cure
• Room temperature storage
• Thermal Conductivity: 1.8 W/m-K
• Eliminates need for mechanical fasteners
• Maintains structural bond in severe-environment applications
• Excellent chemical and mechanical stability