BERGQUIST LIQUI BOND TLB SA3500, Thermally Conductive, Two-Part, Liquid Silicone Adhesive BERGQUIST® LIQUI BOND TLB SA3500 is a higher performance, thermally conductive, liquid adhesive. This material is supplied as a two-part material and requires no refrigeration. The mixed material cures at elevated temperatures. As cured, BERGQUIST LIQUI BOND TLB SA3500 provides a strong bonding, form-in-place elastomer. The material's mild elastic properties assist in relieving CTE stresses during thermal cycling. Liquid dispensed thermal materials offer infinite thickness variations and impart little to no stress on sensitive components during assembly. BERGQUIST LIQUI BOND TLB SA3500 is available with optional glass spacer beads to provide a consistent bond line and ensure dielectric integrity.

• Thermal Conductivity: 3.5 W/m-K
• Eliminates need for mechanical fasteners
• Room Temperature Storage
• Maintains structural bond in severe-environment applications
• Heat cure