BERGQUIST GAP PAD 2202SF, Silicone-Free, High Performance Thermally Conductive, Fiberglass Carrier, Silicone Free, Polymer Pad

BERGQUIST® GAP PAD® 2202SF is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The BERGQUIST GAP PAD 2202SF compound is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces.

BERGQUIST GAP PAD 2202SF is specifically designed for silicone-sensitive applications. The material's construction features a 0.5 mil PET film on one side and natural tack on the other. The natural tack eliminates the need for an additional adhesive layer.

Options and Configurations

Standard sheet size - 9" x 18" or custom configuration
Standard thickness available - 0.010", 0.023", 0.030", 0.040", 0.045", 0.060", 0.080", 0.100", 0.125"

Custom made configurations available upon request

Benefits

• Thermal conductivity: 2.0 W/m-K
• Silicone-free formulation
• Minimal compression set
• 0.5 mil film provides tack-free surface
• Tacky side allows for ease of handling and placement