LOCTITE ABLESTIK 8008, Proprietary Hybrid Chemistry, Die Attach

LOCTITE® ABLESTIK 8008 snap curable adhesive is designed for small die sizes (<3mm). It exhibits moderate electrical and thermal conductivity. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. LOCTITE ABLESTIK 8008 should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes.

• Electrically conductive
• Snap curable after B-stage
• Thermally conductive
• Low modulus
• Stencil printing
• Void-free bondline without bleed