EPO-TEK® OG116-31 is an UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries. EPO-TEK® OG116-31 Advantages & Application Notes: Viscosity/rheology adapted to high volume syringe needle dispensing with no tailing. Versatility in cure. Product responds to a broad range of UV light, and secondary thermal post-curing. Suggested applications:
o Semiconductor: COB glob top covering IC’s and wire bonds; glob top dam; encapsulating and sealing; adhesion to FR4, Kapton, silicon.
o Fiber Optic: making fiber optic pigtails; active alignment of optics; adhesion to many types of glass, metals, ceramics and plastics.
o Opto-electronic: Perimeter/main seal for LCD’s, compatible with VAN liquid crystal for LCoS devices. Adhesive technology described in Technical Paper # 55 - http://www.epotek.com/technical-papers.asp High Tg and low outgassing are indicative of its high temperature performance.