Industrial Adhesives from Epoxy Technology

Thermally Conductive Epoxy for Die Stamping -- EPO-TEK® H70S

Thermally Conductive Epoxy for Die Stamping -- EPO-TEK® H70S -- View Larger Image
Thermally Conductive Epoxy for Die Stamping -- EPO-TEK® H70S-Image

Specifications

Product Category
Industrial Adhesives
Chemical System
Epoxy
Composition
Filled
Cure / Technology
Thermoset; Two Component  
Features
Encapsulant, Potting Compound; Thermally Conductive
Substrate Compatibility
Ceramic, Glass; Metal; Plastic
Industry
 
Viscosity
 
Use Temperature
 
Thermal Conductivity
 
CTE
 
Dielectric Constant