3M™ Scotch-Weld™ Structural Adhesive Film AF 3109-2 is a thermosetting, modified epoxy adhesive film. Scotch-Weld AF 3109-2 film was designed for bonding honeycomb and metal-to-metal components where high strength at 300°F (149°C) is required.
Scotch-Weld AF 3109-2 can be used with 3M™ Scotch-Weld™ Structural Adhesive Primer EC-3960.
Excellent performance in honeycomb and metal-to-metal sandwich applications in a -67 to 300F (-55 to 149C) temperature reange. Cure temperatures as low as 225F (107C) and up to 350F (177C). Improved reisitance to high moisture pre-cure conditions. Unsupported version can be reticulated on honeycomb.