TE Connectivity DIP Sockets 2-1437539-9

Description
Body Features Connector Profile : Standard Frame Style : Open Configuration Features Number of Positions : 16 PCB Mount Orientation : Vertical Contact Features Contact Current Rating (Max) (AMP) : 3 Contact Fabrication : Stamped & Formed Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 25 Dimensions Row-to-Row Spacing : 7.62 MM  [.3 INCH ] Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Signal Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : Straight Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
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Product
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DIP Sockets - 2-1437539-9 - TE Connectivity
Berwyn, PA, United States
DIP Sockets
2-1437539-9
DIP Sockets 2-1437539-9
Body Features Connector Profile : Standard Frame Style : Open Configuration Features Number of Positions : 16 PCB Mount Orientation : Vertical Contact Features Contact Current Rating (Max) (AMP) : 3 Contact Fabrication : Stamped & Formed Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 25 Dimensions Row-to-Row Spacing : 7.62 MM  [.3 INCH ] Housing Features Centerline (Pitch) : 2.54 MM  [.1 INCH ] Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Signal Product Type Features Connector & Contact Terminates To : Printed Circuit Board Leg Style : Straight Termination Features Termination Method to Printed Circuit Board : Through Hole - Solder Usage Conditions Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]

Body Features


  • Connector Profile : Standard
  • Frame Style : Open

Configuration Features


  • Number of Positions : 16
  • PCB Mount Orientation : Vertical

Contact Features


  • Contact Current Rating (Max) (AMP) : 3
  • Contact Fabrication : Stamped & Formed
  • Contact Mating Area Plating Material : Gold
  • Contact Mating Area Plating Material Thickness (MICIN) : 25

Dimensions


  • Row-to-Row Spacing : 7.62 MM  [.3 INCH ]

Housing Features


  • Centerline (Pitch) : 2.54 MM  [.1 INCH ]

Mechanical Attachment


  • Connector Mounting Type : Board Mount

Operation/Application


  • Circuit Application : Signal

Product Type Features


  • Connector & Contact Terminates To : Printed Circuit Board
  • Leg Style : Straight

Termination Features


  • Termination Method to Printed Circuit Board : Through Hole - Solder

Usage Conditions


  • Operating Temperature Range : -55 - 125 DEGC  [-67 - 257 DEGF ]
Supplier's Site

Technical Specifications

  TE Connectivity
Product Category IC Interconnect Components
Product Number 2-1437539-9
Product Name DIP Sockets
Product Type IC Socket
Socket Type DIP
Mounting Board Mount
Current Rating 3 amps
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