Body Features Connector Profile : Low Ejector Location : Both Ends Ejector Type : Locking Latch Material : High Temperature Thermoplastic Module Key Type : Offset Left Retention Post Location : Both Ends
Configuration Features Module Orientation : Right Angle Number of Keys : 1 Number of Positions : 260 Number of Rows : 2
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : .5 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .254 MICM [10 MICIN ] Memory Socket Type : Memory Card PCB Contact Termination Area Plating Material : Gold Flash
Dimensions Row-to-Row Spacing : 8.2 MM [.322 INCH ] Stack Height : 5.2 MM [.205 INCH ]
Electrical Characteristics DRAM Voltage (V) : 1.2
Housing Features Centerline (Pitch) : .5 MM [.02 INCH ] Housing Color : Black Housing Material : High Temperature Thermoplastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment Type : Standard Keying PCB Mount Retention : With PCB Mount Retention Type : Solder Peg
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Tape & Reel Packaging Quantity : 800
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Cable-to-Board DRAM Type : Small Outline (SO)
Signal Characteristics SGRAM Voltage (V) : 1.2
Termination Features Insertion Style : Cam-In Termination Method to Printed Circuit Board : Surface Mount
Usage Conditions Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
Body Features
- Connector Profile : Low
- Ejector Location : Both Ends
- Ejector Type : Locking
- Latch Material : High Temperature Thermoplastic
- Module Key Type : Offset Left
- Retention Post Location : Both Ends
Configuration Features
- Module Orientation : Right Angle
- Number of Keys : 1
- Number of Positions : 260
- Number of Rows : 2
Contact Features
- Contact Base Material : Copper Alloy
- Contact Current Rating (Max) (AMP) : .5
- Contact Mating Area Plating Material : Gold
- Contact Mating Area Plating Material Thickness : .254 MICM [10 MICIN ]
- Memory Socket Type : Memory Card
- PCB Contact Termination Area Plating Material : Gold Flash
Dimensions
- Row-to-Row Spacing : 8.2 MM [.322 INCH ]
- Stack Height : 5.2 MM [.205 INCH ]
Electrical Characteristics
Housing Features
- Centerline (Pitch) : .5 MM [.02 INCH ]
- Housing Color : Black
- Housing Material : High Temperature Thermoplastic
Industry Standards
- UL Flammability Rating : UL 94V-0
Mechanical Attachment
- Connector Mounting Type : Board Mount
- Mating Alignment Type : Standard Keying
- PCB Mount Retention : With
- PCB Mount Retention Type : Solder Peg
Operation/Application
- Circuit Application : Power
Packaging Features
- Packaging Method : Tape & Reel
- Packaging Quantity : 800
Product Type Features
- Connector & Contact Terminates To : Printed Circuit Board
- Connector System : Cable-to-Board
- DRAM Type : Small Outline (SO)
Signal Characteristics
Termination Features
- Insertion Style : Cam-In
- Termination Method to Printed Circuit Board : Surface Mount
Usage Conditions
- Operating Temperature Range : -55 - 85 DEGC [-67 - 185 DEGF ]
