Aries Electronics, Inc. High-Temp (up to 200°C) CSP Burn-in & Test Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices or Any Custom Machined Configuration

KEY PERFORMANCE ELEMENTS – Series AR4HT High-Temperature 200°C (high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing) Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). Excellent choice for low-cost hand test applications MECHANICAL CONTACT LENGTH (compressed): 0.45mm PITCH: Released to <0.4mm – Mixed Pitch Available PACKAGES: BGA, LGA, QFN, DFN, CSP, POP – Full and Partial Arrays Available STRUCTURE: Silmat® Interposer with Patented Core INTERPOSER MATERIALS: Ag Particles in Silicone Elastomer with Polyimide Core (patented) COMPLIANCE RANGE/TRAVEL: Up to 0.23mm CONTACT FORCE/LEAD (initial): 20-30 grams/lead OPERATING TEMPERATURE: -67°F to 392°F (-55°C to 200°C) LIFE EXPECTANCY: Silmat® Interposer >10,000 actuations (influenced by introduction of bias to the IC and the plating of IC leads will impact the degradation of the contact performance) ELECTRICAL (0.5mm pitch) BANDWIDTH (frequency response): -1dB at >40GHz SELF-INDUCTANCE: 0.10nH MUTUAL INDUCTANCE: 0.02nH CAPACITANCE TO GROUND: 0.14pF MUTUAL CAPACITANCE: 0.01pF CONTACT RESISTANCE (initial): <25mW CURRENT RATING: 4 amps at 14°C heat rise