Small laser spot size; narrow line width.
Small heat-affected zone.
Flexible non-contact processing, able to process any shape.
Layer-by-layer processing; switchable gas source.
Image target capturing for automatic processing.
Positional accuracy: ±4μm (JIS Standard)
Repeatability: ±2μm (JIS Standard)
Minimum drilling aperture: 30μm
Minimum cutting line width: 20μm
Scribing speed: 200mm/s
Processable material thickness: ≤2mm
Maximum cutting speed: 40mm/s
Hole-drilling speed: >8 holes per second
Hole-drilling diameter range: 40-400μm
Thick film and thin film circuit boards
Microcrystalline zirconium outer parts
Stainless steel and other metals