ELVM .150" spacing wire-to-board terminal blocks are available in vertical, horizontal and angled wire entry variations.
The ELVM is suitable for SMT reflow solder PCB manufacturing processes as well as wave solder, providing users with additional flexibility and maximizing production efficiencies by eliminating secondary solder operations. Terminal blocks are molded of ultra-high-temperature, glass-filled polyamide that will withstand temperatures of 260°C during PCB production.
Moving cage clamp wire termination assures repeated, high-reliability connections. The housing is molded to size. Blocks are available in sizes 2 to 10, and can be stacked side-to-side on a board without loss of a contact position.