| Product Name |
Notes |
| EP21TCDC-4 | Bonding and sealing; features high peel strength and shock resistance |
| EP21TDCANHT | EP21TDCANHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally... |
| EP21TDCAOHT | EP21TDCAOHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a superb adhesive sealant, with exceptionally... |
| S10HTFRSM, S10HTFS | High shear and peel strength, outstanding electrical conductive properties |
| EP121AO | Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing,... |
| EP28 | Master Bond EP28 is a clear, low viscosity two-component epoxy adhesive system that contains no solvent and cures quickly at room temperature to form exceptionally strong bonds to most metals... |
| EP28-1 | Master Bond EP28-1 is a clear, low viscosity two-component high impactepoxy adhesive system that contains no solvent and cures quickly at room temperature to form exceptionally strong bonds to most... |
| EP29 | Master Bond EP29, a metal filled, two component room temperature curing epoxy adhesive, is a uniquely versatile metal filled epoxy adhesive system which is widely employed for industrial maintenance, repair,... |
| EP29-1 | Master Bond EP29-1, a novel versatile, two component room temperature curing epoxy adhesive, is a uniquely versatile tough epoxy adhesive system which is widely employed for industrial assembly, coating, casting... |
| EP34CA | Master Bond EP34CA is a low viscosity, polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures, potting and casting applications. When used in conjunction with various... |
| EP41ATC | Master Bond EP41ATC Epoxy Resin System is a solvent-free, two component epoxy resin system designed for applications where hard, tough, special corrosion resistant electrically conductive seamless flooring is required. It... |
| EP52 | Master Bond EP52 is a one component epoxy resin system for high strength structural bonding with exceptionally good adhesion to me tals, glass, ceramics, vulcanized rubbers and many plastics . |
| EP30D-12, EP30D-15, FL901S, FL901S2 | Master Bond FL901S Polymer System is a high performance silver filled unsupported epoxy resin based adhesive film which offers outstanding performance characteristics and does not require refrigerated storage although refrigeration... |
| MS705S | Master Bond MasterSil 705S is an easy-to-use, one component, non-corrosive, electrically conductive, silver filled, silicone for bonding and sealing. The material is a gray colored paste. It cures readily at... |
| MS705TC | Master Bond MasterSil 705TC is an easy-to-use, one component, thermally conductive, electrically isolating, high performance silicone for bonding, sealing and coating. The material is an off-white colored paste. It cures... |
| EP21AN | Master Bond Polymer Adhesive EP21AN is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. It has... |
| EP21ANHT | Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft² •hr•°F. EP21ANHT is... |
| EP21AO | Master Bond Polymer Adhesive EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or volume. This versatile... |
| EP21AOHT | Master Bond Polymer Adhesive EP21AOHT is a high temperature resistant, two component, thermally conductive, electrically isolating epoxy adhesive, sealant, and coating with a forgiving 1:1 mix ratio by weight or... |
| EP21AOHTLV | Master Bond Polymer Adhesive EP21AOHTLV is a low viscosity two component heat resistant epoxy adhesive, sealant and encapsulant formulated to cure at room temperature or more rapidly at elevated temperatures,... |
| EP21CL-1 | Master Bond Polymer Adhesive EP21CL-1 is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures with a two-to-one... |
| EP21HTAOTDC | Master Bond Polymer Adhesive EP21HTAOTDC is a two component thermally conductive epoxy adhesive for high performance bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with... |
| EP21LP-IND | Master Bond Polymer Adhesive EP21LP-IND is a two component, high strength epoxy adhesive for high performance general purpose bonding and sealing formulated to feature long pot life (2-4 hours) at... |
| EP21LVSP3, EP30R | Master Bond Polymer Adhesive EP21LVSP3 is a two component epoxy compound for high performance coating, sealing and bonding formulated to cure at room temperature or more rapidly at elevated temperatures,... |
| EP21ND-2 | Master Bond Polymer Adhesive EP21ND-2 is a two component epoxy adhesive for general purpose bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with... |
| EP21-1, EP21TDC | Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one... |
| EP21TDCHT | Master Bond Polymer Adhesive EP21TDCHT is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one... |
| EP21TDCHT-1 | Master Bond Polymer Adhesive EP21TDCHT-1 is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one... |
| EP21TPHTAO | Master Bond Polymer Adhesive EP21TPHTAO is a two component thermally conducitve, electrically insulative polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with... |
| EP21TPND | Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100... |
| EP23 | Master Bond Polymer Adhesive EP23 is a mineral filled two component epoxy adhesive for high performance bonding formulated to cure at room temperature or more rapidly at elevated temperature with... |
| EP24AN | Master Bond Polymer Adhesive EP24 is a fast curing two component epoxy adhesive for general purpose bonding, sealing, and coating formulated to cure at room temperature with a one-to-one mix... |
| EP24AO | Master Bond Polymer Adhesive EP24AO is a fast setting two component room temperature curing adhesive, sealant and coating that has a high thermal conductivity of over 10 BTU•in/ft² •hr•°F. It... |
| EP25 | Master Bond Polymer Adhesive EP25 is a fast curing aluminum filled two component epoxy adhesive for general purpose bonding and sealing formulated to cure at room temperature with a one-to-one... |
| EP26 | Master Bond Polymer Adhesive EP26 is a fast curing mineral filled two component epoxy adhesive for general purpose bonding and sealing formulated to cure at room temperature with a one-to-one... |
| EP3 | Master Bond Polymer Adhesive EP3 represents a breakthrough in epoxy adhesive technology featuring a hitherto unattainable balance of performance properties including both high shear and high cure speed. This one... |
| EP30AO-1 | Master Bond Polymer Adhesive EP30AO-1 is a two component epoxy resin system for high performance general purpose bonding and sealing formulated to cure quickly at room temperature but requiring a... |
| EP30ND | Master Bond Polymer Adhesive EP30ND is a high viscosity, two component epoxy adhesive for general purpose bonding and repair formulated to cure at room temperature or more rapidly at elevated... |
| EP31T | Master Bond Polymer Adhesive EP31T is a non-dripping clear two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with... |
| EP33 | Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more... |
| EP33LV | Master Bond Polymer Adhesive EP33LV is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more... |
| EP33UN | Master Bond Polymer Adhesive EP33UN is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more... |
| EP35 | Master Bond Polymer Adhesive EP35 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more... |
| EP35SP | Master Bond Polymer Adhesive EP35SP is a unique heat curing two component epoxy adhesive for tough high temperature bonding applications. It is formulated to cure at elevated temperatures, with a... |
| EP35TDC | Master Bond Polymer Adhesive EP35TDC is a unique room temperature curing, high viscosity, two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature... |
| EP46 | Master Bond Polymer Adhesive EP46 is a two component epoxy adhesive for high performance structural bonding suitabie for applications where long term exposure to temperatures from - 67° to 300°F... |
| EP50 | Master Bond Polymer Adhesive EP50 is an exceptionally fast curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by... |
| EP50-1 | Master Bond Polymer Adhesive EP50-1 is an exceptionally fast curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by... |
| EP50-1.5 | Master Bond Polymer Adhesive EP50-1.5 is an exceptionally fast curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by... |
| EP50-2 | Master Bond Polymer Adhesive EP50-2 is an exceptionally fast curing two component epo y adhesive for general purpose bonding formulated to cure at room temperature with a two-to-one mix ratio... |
| EP51 | Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio... |
| EP51HT | Master Bond Polymer Adhesive EP51HT represents a significant advance in epoxy adhesive technology featuring an excellent balance of performance properties, including convenient curing at ambient temperatures, and superior cost effective... |
| EP51M | Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio... |
| EP51ND | Master Bond Polymer Adhesive EP51ND is a high viscosity, fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one... |
| EP65 | Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly... |
| EP65ND | Master Bond Polymer Adhesive EP65ND represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly... |
| EP72 | Master Bond Polymer Adhesive EP72 is a two component, tough, resilient elastomer modified epoxy adhesive for high performance general purpose bonding with execptionally high impact and peel strength. It is... |
| EP72M3 | Master Bond Polymer Adhesive EP72M3 is a two component, tough, resilient, elastomeric modified epoxy for high performance bonding, sealing and coating with exceptionally high impact and peel strength along with... |
| S10ANHT | Master Bond Polymer Adhesive Supreme 10ANHT represents a breakthrough in epoxy adhesive technology featuring a hitherto unattainable balance of performance properties including both high shear and high peel strengths, plus... |
| S45HTAO | Master Bond Polymer Adhesive Supreme 45HTAO is a two component thermally conductive, electrically insulative epoxy adhesive featuring an attractive balance of superior shear and peel strengths for high performance structural... |
| S10AN | Master Bond Polymer Adhesive SUPREME10AN represents a breakthrough in epoxy adhesive technology featuring a hitherto unattainable balance of performance properties including both high shear and high peel strengths, plus exceptionally... |
| S10AOHT | Master Bond Polymer Adhesive SUPREME10AOHT represents a breakthrough in epoxy adhesive technology featuring a hitherto unattainable balance of performance properties including both high shear and high peel strengths. It also... |
| S11AN | Master Bond Polymer Adhesive System Supreme 11AN is a two component thermally conductive heat resistant epoxy adhesive with a one-to-one mix ratio, weight or volume. It readily develops a high... |
| EP21CE | Master Bond Polymer Coating EP21CE is a two component abrasion resistant epoxy coating system for high performance industrial coating applications formulated to cure at room temperature or more rapidly at... |
| EP22P | Master Bond Polymer Compound EP22P is a two component metallic epoxy resin system specially designed for repair of damaged metal structures and formulated to cure at room temperature or more... |
| EP45HTAO | Master Bond Polymer Compound EP45HTAO is a two component thermally conductive epoxy compound for high performance structural bonding, and casting. It is suitable for applications where long term exposure to... |
| EP125 | Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500°F with truly outstanding chemical resistance. High strength bonds serviceable up to 600°F can... |
| EP112AO | Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where... |
| EP11C | Master Bond Polymer System EP11C is a new superior and cost effective one component epoxy resin system featuring high electrical, superior conductivity for electrical contacts, bonding, sealing and coating which... |
| EP11HT | Master Bond Polymer System EP11HT is a one component, heat curing, structural epoxy adhesive featuring high shear strength, easy handling and high temperature resistance. This one component system is formulated... |
| EP11S | Master Bond Polymer System EP11S is a new superior performance and cost effective one component epoxy resin system featuring excellent electrical conductivity for electrical contacts, bonding sealing and coating and... |
| EP120SP | Master Bond Polymer System EP120SP is a two-component epoxy/anhydride system for high performance resistant gel coats ancl protective coatings for filament wound structures. It is, 100% reactive and does not... |
| EP19SC | Master Bond Polymer System EP19SC is a one component silver filled electrically conductive epoxy adhesive ocmpound wiht excellent chemical resistant and thermal stability characteristics. This adhesive features very low levels... |
| EP21BAS | Master Bond Polymer System EP21BAS is a radioopaque two component epoxy compound which cures readily at ambient or more quickly at elevated temperatures. This epoxy polymer system features outstanding physical... |
| EP21CLV | Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures,... |
| EP21CT | Master Bond Polymer System EP21CT is a two component epoxy-coal tar compound for high performance coatings, linings and sealants. The Master Bond Polymer System EP21CT is readily prepared for use... |
| EP21CT100 | Master Bond Polymer System EP21CT100 is a unique two component epoxy urethane-coal tar compound for high performance coatings, linings and sealants. The Master Bond Polymer System EP21CT100 is readily prepared... |
| EP21FLVSP | Master Bond Polymer System EP21FLVSP is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting. It is formulated to cure readily at... |
| EP21FRLVSP, SM43HT | Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio,... |
| EP21FRNS, EP30 | Master Bond Polymer System EP21FRNS is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio,... |
| EP21HTTDC | Master Bond Polymer System EP21HTTDC is a unique two component, toughened epoxy compound for high performance bonding, sealing and casting featuring high peel strength, superior resistance to vibration, impact and... |
| EP21LS | Master Bond Polymer System EP21LS is a two component, epoxy resin system featuring greatly enhanced weatherability and color retention for high performance coating, bonding, sealing and casting. It is formulated... |
| EP21LSCL | Master Bond Polymer System EP21LSCL is a two component, low viscosity epoxy resin system featuring optical clarity and non-yellowing properties for high performance coating, bonding, sealing and casting. It is... |
| EP21ND | Master Bond Polymer System EP21ND is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties, a very forgiving 1 to 1 mix ratio by weight or volume... |
| EP21SC | Master Bond Polymer System EP21SC is a two component silicon carbide containing epoxy resin compound for high performance abrasion resistant, tough coatings, liners and adhesive/sealants formulated to cure at room... |
| EP21SI | Master Bond Polymer System EP21SI is a two component, high performance, electrically isolating epoxy composition for potting, adhesive, sealant, and coating applications with a noncritical 1:1 mix ratio by weight... |
| EP21SL5 | Master Bond Polymer System EP21SL5 is a two component high performance epoxy resin system for bonding teak and other wood products which combines high physical strength properties, remarkable abrasion, thermal... |
| EP21TCHT-1 | Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100/60... |
| EP21LPT-6, EP21TDC-2 | Master Bond Polymer System EP21TDC-2 is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating and encapsulation. It is formulated to cure fully at ambient... |
| EP21TDC-2AN | Master Bond Polymer System EP21TDC-2AN is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient... |
| EP21TDC-2AO | Master Bond Polymer System EP21TDC-2AO is a two component highly flexible epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient... |
| EP21TDC-2LO | Master Bond Polymer System EP21TDC-2LO is a low outgassing two component highly flexible, thermally conductive epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to... |
| EP21TDC-4 | Master Bond Polymer System EP21TDC-4 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or... |
| EP21TDC-4HT | Master Bond Polymer System EP21TDC-4HT is a unique two component, toughened epoxy compound for high performance bonding, sealing and casting featuring high peel strength, superior resistance to vibration, impact and... |
| EP21TDC-7 | Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or... |
| EP21TDCF-1 | Master Bond Polymer System EP21TDCF-1 is a two component epoxy adhesive for high performance bonding formulated to cure quickly at room temperature or more rapidly at elevated temperatures, with a... |
| EP21TDCN | Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or more rapidly at elevated temperatures. |
| EP21TDCNFL | Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... |
| EP21TDCS | Master Bond Polymer System EP21TDCS is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... |
| EP21TDCS MED | Master Bond Polymer System EP21TDCS MED is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at... |
| EP21TDCS-LO | Master Bond Polymer System EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... |
| EP21TDCSFL | Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... |
| EP21TDCSP-1 | Master Bond Polymer System EP21TDCSP-1 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many... |
| EP22 | Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more... |
| EP28M | Master Bond Polymer System EP28M is a remarkably fast curing, low viscosity, two component epoxy compound formulated for high performance casting and bonding. It is 100% reactive and does not... |
| EP28M-1 | Master Bond Polymer System EP28M-1 is a remarkably high performance room temperature curing low viscosity, two component epoxy compound formulated for high performance casting and bonding. It is 100% reactive... |
| EP29LP | Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will... |
| EP29LPSP | Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function... |
| EP30-2SP | Master Bond Polymer System EP30-2SP is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly... |
| EP30AN | Master Bond Polymer System EP30AN is a two component epoxy resin system for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and excellent electrical insulation properties. |
| EP30AN-1 | Master Bond Polymer System EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity, excellent electrical insulation properties and NASA low... |
| EP30ANHT | Master Bond Polymer System EP30ANHT is a two component epoxy resin system for high performance general purpose bonding, sealing and potting formulated to cure at room temperature or more rapidly... |
| EP30AO | Master Bond Polymer System EP30AO is a two component epoxy resin system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at... |
| EP30AOHT | Master Bond Polymer System EP30AOHT is a two component epoxy resin system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at... |
| EP30AOSP | Master Bond Polymer System EP30AOSP is a two component epoxy resin system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at... |
| EP30BN | Master Bond Polymer System EP30BN is a two component boron nitride epoxy resin system for high performance bonding, sealing, coating and potting featuring remarkably high thermal conductivity and excellent electrical... |
| EP21TDC, EP30C | Master Bond Polymer System EP30C is a new, versatile two component nickel modified polymer system featuring high electrical conductivity, superior bonding strength and chemical resistance for EMI/RFI shielding as well... |
| EP30FLAO | Master Bond Polymer System EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is formulated to cure at room temperature or more... |
| EP31 | Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many... |
| EP32 | Master Bond Polymer System EP32 is a low viscosity, highly flexibe, two component epoxy resin based polymer system for high performance potting, casting, encapsulation as well as bonding and sealing. |
| EP34 | Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature... |
| EP34AN | Master Bond Polymer System EP34AN is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where very high thermal conductivity is required. It... |
| EP34AO | Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity is required. It is formulated... |
| EP36 | Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination... |
| EP36AO | Master Bond Polymer System EP36AO is a truly unique one component high performance flexibilized epoxy system for electrical potting and encapsulation, baked coatings and adhesive applications. It features an outstanding... |
| EP37-3FLFAN | Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures... |
| EP37-3FLFAO | Master Bond Polymer System EP37-3FLFAO is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures... |
| EP3ANHT | Master Bond Polymer System EP3ANHT is a new superior and cost effective epoxy resin system for electrical potting, encapsulation and bonding which combines high physical strength properties, remarkable abrasion, thermal... |
| EP3AOHT | Master Bond Polymer System EP3AOHT is a new superior and cost effective epoxy resin system for electrical potting, encapsulation, and bonding. It combines high physical strength, including resistance to abrasion,... |
| EP3AOHTLV | Master Bond Polymer System EP3AOHTLV is a new superior and cost effective epoxy resin system for electrical potting, encapsulation, and bonding with combines high physical strength properties, remarkable abrasion, thermal... |
| EP45HTSPF | Master Bond Polymer System EP45HTSPFE3 is a two component steel filled epoxy system for high performance structural bonding and casting suitable for applications where long term exposure to temperatures from... |
| EP46HT-1 | Master Bond Polymer System EP46HT-1 is a two component epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures from -100°F to +550°F is... |
| EP51FL-1 | Master Bond Polymer System EP51FL-1 is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very slow curing,... |
| EP51N | Master Bond Polymer System EP51N is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio... |
| EP51Q | Master Bond Polymer System EP51Q is a two component quartz filled epoxy compound for high performance corrosion resistant coating and bonding formulated to cure at room temperature or more rapidly... |
| EP55HT | Master Bond Polymer System EP55HT is an entirely novel one component high performance adhesive/sealant for applications requiring service at temperatures as high as 500°F. It is supplied as a reddish-brown... |
| EP65HT | Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting... |
| EP65HT-1 | Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting... |
| EP65HT-3 | Master Bond Polymer System EP65HT-3 represents a significant improvement in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast... |
| 75 | Master Bond Polymer System EP75 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly... |
| 75-1 | Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly... |
| EP76M | Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly... |
| EP76M1R | Master Bond Polymer System EP76M-1R is a two component, nickel filled, electrically conductive adhesive for high performance bonding formulated to cure at room temperature or more rapidly at elevated temperatures. |
| EP77M-1 | Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at... |
| EP77M-F | Master Bond Polymer System EP77M-F is a two component, silver filled, electrically conductive adhesive for high performance bonding formulated to cure very rapidly at room temperature. Unlike the majority of... |
| EP77MHT-1 | Master Bond Polymer System EP77MHT-1 is a two component silver-filled conductive epoxy adhesive featuring an exceptionally attractive balance of processing and performance characteristics so as to fit a wide variety... |
| EP78 | Master Bond Polymer System EP78 is a cost effective two component silver conductive epoxy ceramic adhesive featuring an exceptionally attractive balance of processing and performance characteristics so as to fit... |
| EP79 | Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more... |
| EP80 | Master Bond Polymer System EP80 is a two component, silver coated copper filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more... |
| FL901AO, FL901AO2 | Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film... |
| MS726 | Master Bond Polymer System MasterSil#726 is a non-curing grease-like thermally conductive silicone compound. It is extremely stable, it will not dry out, cure, harden, or bleed, even after exposure to... |
| EP36-2 | Master Bond Polymer System represents a truly remarkable technical advance in the field of electrical insulation materials offering the first easily processable one component semi-solid epoxy resin based compound with... |
| S10HTS | Master Bond Polymer System Supreme 10HT/S represents a breakthrough in conductive epoxy technology, featuring a combination of high performance properties including both high shear and high peel strengths, low resistance,... |
| S10HTN | Master Bond Polymer System Supreme 10HTN represents a breakthrough in conductive epoxy adhesive technology featuring a combination of high performance properties including both high shear and high peel strengths, relatively... |
| S11ANHT | Master Bond Polymer System SUPREME 11ANHT is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated... |
| S11AOHT | Master Bond Polymer System Supreme 11AOHT is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated... |
| S3AN | Master Bond Polymer System SUPREME 3AN is a one component, heat cured epoxy adhesive and sealant, featuring high peel and shear strength along with excellent thermal conductivity and convenient handling. |
| S3ANHT | Master Bond Polymer System Supreme 3ANHT is a one component, heat cured epoxy adhesive and sealant, featuring high peel and shear strength along with excellent thermal conductivity and convenient handling. |
| S3AO | Master Bond Polymer System Supreme 3AO is a storage stable one component, heat curing epoxy adhesive featuring a hither to unattainable balance of performance properties including both high shear and... |
| S3AOHT | Master Bond Polymer System Supreme 3AOHT is a one component, heat cured epoxy adhesive and sealant, featuring high peel and shear strength along with excellent thermal conductivity and convenient handling. |
| S42HTAO-1 | Master Bond Polymer System Supreme 42HTAO-1 is a room temperature curable two component epoxy adhesive, sealant, coating and casting material featuring high temperature resistance and outstanding chemical resistance. It is... |
| S11AO | Master Bond Polymer System SURPEME 11AO is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated... |
| X-5N | Master Bond Polymer Systems X5N Nickel, X5G Graphite and X5SC Silver are novel, highly cost effective one component electrically conductive elestomer based adhesive/sealants for EMI/RFI shielding and related applications. They... |
| EP21S | Master Bond System EP21S is a two component high strength, tough epoxy resin system for high performance industrial bonding, sealing and coating applications formulated to cure readily at ambient temperatures... |
| EP46HT | Master Bond System EP46HT is a newly formulated two component high performance heat resistant epoxy resin system with excellent mechanical strength and chemically resistant properties for structural bonding, sealing and... |
| X5TC | Master Bond X-5TC is an aluminum oxide filled, thermally conductive elastomer-based, one component adhesive for high performance bonding and sealing. This thermally conductive adhesive bonds well in both shear and... |
| S10HT, S10HTBOE, S10HTCL, S10HTLOC | NASA approved low outgasssing, superior thermal shock resistance |
| EP11SIC | One component, Electrically Conductive (Silver Filled), Thermal Shock, Heat and Chemically Resistant Epoxy Resin System for Bonding, Potting, Sealing and Coating. Master Bond Polymer System EP11SIC is a new superior... |
| EP75DRB | Outstanding dimensional stability, good lubricity, non-magnetic |
| S10HTFN | Superior resistance to thermal shock, impact, heat and chemicals |
| S10HTF, S10HTFL | Superior thermal shock, impact and stress cracking fatigue resistance |
| EP62 | The EP62 is a semi-latent two component epoxy resin system with a long room temperature pot life (minimum 7 days with a minimal viscosity change for a one pound batch)... |
| EP27T | There is a steadily growing demand for adhesive, sealants, coatings and castings which can be applied and cured at temperatures of 40°F and below. Master Bond Polymer System EP27 is... |
| EP21HTAR-1 | Two comp,. high peel, resistant to vibration impact & shock service to 400F |
