AdTech prides itself on being the innovation leader in the ceramic package business. Co-fired ceramic technology was invented in our Chattanooga facility over 35 years ago, and numerous patents have been issued over the years.
Today, the company remains the leading US-owned non-captive supplier of ceramic electronic packages, and continues to lead the industry.
AdTech's patented "split-via" concept provides an exceptionally reliable method of edge metallization without concern for processing damage at the point where metallization wraps around the edges.
A Ceramic pedestal may be used in the package design to allow for self-jigging of metal or ceramic Seal-Ring.
Microwave Design Assistance
AdTech Ceramics produces HTCC and AlN packages for microwave applications in the X through K band frequency ranges.
This process can yield market-differentiating performance while maintaining cost effective solutions.
AdTech Ceramics is able to analyze and improve the thermal performance of the ceramic package. It does so by using its unique combination of proprietary thermal analysis tools, commercially available thermal analysis software and highly qualified engineering staff. Refractory Metal Standoffs
For the ultimate in standoffs, AdTech can co-fire refractory metal "bumps" on BGAs or substrates that will retain their shape through multiple solder reflow operations.
Multilayer ceramic electronic packages can be produced with a wide choice of materials, each designed to meet specific application needs. The choices include:
AdTech offers a choice of ceramic materials:
Aluminum Nitride (AlN)
Low Temp Co-fired Ceramic (LTCC)
Beryllium Oxide (BeO)
Additionally, custom materials can be developed to meet special needs.