Aries Electronics, Inc. Datasheets for IC Sockets and Headers

IC sockets and headers are board-mounted female connectors that serve as carriers for integrated circuit (IC) chips.
IC Sockets and Headers: Learn more

Product Name Notes
CSP/µBGA Test & Burn-in Socket w/Adjustable Pressure Pad for Any Device Package on 0.2mm Pitch and Higher Up to 27mm Square FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications Any device pitch from 0.20mm Pressure mounting, no soldering required...
CSP Test Socket for Optical Laser Failure Analysis w/Emission Microscopy on any grid size pitch of 0.2mm or higher Available with or without filters for UV, infrared and full spectrum applications, Aries’ new optical test socket is ideal for testing an optical sensor type chip and for EMMI testing...
DIP ZIF Zero-Insertion-ForceTest Socket – Series 516 EATURES A choice of 24-, 28-, or 40-pin count devices can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove...
Low-Profile DIP ZIF Socket – Series 526 FEATURES A choice of 24, 28, or 40 pin count devices can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or...
Mirror Image Collet Socket FEATURES A cost-effective solution for design problems, this socket reroutes connections from a row of female contacts on top to the opposite row of male pins on bottom ICs can...
High-Temp (up to 200°C) Universal PGA ZIF Burn-in & Test Sockets
PGA ZIF Test and Burn-in Sockets
FEATURES A strong, metal cam activates the normally-closed contacts, preventing dependency on plastic for contact force The handle can be provided on right or left hand side For special handle...
Row-to-Row DIP Adapter Socket
Row-to-Row DIP Adapter Sockets – P/N 1106396 & 1107254
FEATURES Adapter Socket allows the use of 0.300 [7.62] center devices when the PCB is drilled on 0.600 [15.24] centers and vice versa, giving the flexibility of using 0.600 [15.24]...
CSP/BallNest™Hybrid Socket FEATURES Any grid size pitch available from 0.20mm Socket lid nests device into socket for a reliable connection Suitable for prototyping, test, or burn-in of CSP, BGA, µBGA and LGA...
DIP Programable Headers – Series 675 FEATURES Aries DIP Programmable Headers offer unusual versatility for programming within the header itself They can be individually programmed using cutters or Aries programming tool, P/N T-675, available separately, to...
DIP Headers with Coined Contacts – Series 600 FEATURES Aries offers a full line of DIP Headers, available with either Coined or Screw Machine Contacts For Screw Machine Contacts, consult Data Sheet 12035 Snap-on, Protective Covers are available...
DIP Headers with Screw Machine Contacts – Series 625 FEATURES Aries offers a full line of DIP Headers, available with either screw machine or coined contacts in a variety of styles For Coined Contacts, consult Data Sheet 12032 GENERAL...
Vertical Mounting with Bifurcated Contacts – Series 800 Vertisocket™ FEATURES Aries offers a full line of DIP Sockets for packaging of LEDs, incandescent lamps, DIP switches, test points, etc. Variations of mounting position and pin configuration provide exceptional design...
Horizontal Mounting DIP Socket with Bifurcated Contacts – Series 800 Vertisocket™ FEATURES Aries offers a full line of Horizontal Display DIP Sockets for DIP packaging of LEDs, incandescent lamps, DIP switches, test points, etc. Variations of mounting position and pin configuration...
Horizontal Mounting with Collet Contacts – Series 800 Vertisocket™ FEATURES Aries offers a full line of Vertisocket™ for DIP packaging of LEDs, incandescent lamps, DIP switches, test points, etc. Variations of mounting positions provide exceptional design freedom Accepts standard...
Vertical Mounting with Collet Contacts – Series 800 Vertisocket™ FEATURES Aries offers a full line of Vertisockets™ for DIP packaging of LEDs, incandescent lamps, DIP switches, test points, etc. Variations of mounting positions provide exceptional design freedom Accepts standard...
Pin Grid Array Sockets/Headers on 0.100 [2.54] Centers with Solder Tail Pins FEATURES Aries offers a wide number of pin grid array configurations from which to choose Low-insertion-force contacts standard GENERAL SPECIFICATIONS PGM SERIES SOCKET BODY: black UL 94V-0 glass-filled 4/6 Nylon...
Universal DIP ZIF Test Socket – Series X55X FEATURES Aries Universal Test socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 to 15.24]...
Open-Frame Capacitor Collet DIP Sockets with Solder Tail Pins – Series 518
Open-Frame Capacitor Collet DIP Sockets with Wire Wrap Pins – Series 508
FEATURES Capacitor bypasses unwanted electromagnetic noise Available with either 0.1µF or 0.33µF capacitor, 50V, Z5U temperature coefficient Open frame allows for more efficient utilization of board space and better cooling...
Program Headers and Covers – Series 680 FEATURES Complete versatility for programming within the unit itself, thus eliminating the need for DIP switches in many situations. Available pre-programmed from Aries, or do-it-yourself using Aries Hand Tool P/N...
Correct-A-Chip® with Collet Contacts FEATURES Correct-A-Chip® technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs Available...
Universal SOIC ZIF Test Socket – Series 547 FEATURES Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from...
EJECT-A-DIP™ Lock/Eject DIP Collet Sockets with Solder Tail Pins
EJECT-A-DIP™ Lock/Eject DIP Collet Sockets with Surface Mount Pins
FEATURES Eject-A-DIP™ is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance The latch locks in the connector or device, making it ideal for high vibration...
EJECT-A-DIP™ Lock/Eject DIP Collet Sockets with Wire Wrap Pins FEATURES Eject-A-DIP™ is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance The latch locks in the connector or device, making it ideal for high-vibration environments...
Elevator Strip-Line™ Sockets with Bifurcated Contacts – Series 700 FEATURES For elevated mounting of LCDs and other odd-centered or high pin count components Any height from 0.360 to 2.000 [9.14 to 50.80] Optional spacer available for mounting on 0.300...
High-Frequency Center Probe™ Test Socket for Devices up to 55mm Square FEATURES For high-frequency test of CSP, BGA, DSP, LGA, SRAM, DRAM and Flash Devices Any device pitch from 0.20mm 4-point crown insures scrub on solder oxides, while pointed probe works...
Pin-Line™ Series 0517 Vertisocket™ FEATURES For mounting components, jumpers, etc., at right angle to PC board Available in 1 to 25 positions; cuttable to any number desired GENERAL SPECIFICATIONS BODY MATERIAL: black UL 94V-0...
Strip-Line™ Sockets with Bifurcated Contact Solder Pin Tails – Series 0511 FEATURES For mounting liquid crystal displays and other high pin count or odd centered components Available in several sizes with bifurcated contacts in solder pin tails or wire wrap pins...
Strip-Line™ Sockets – Series 0501 FEATURES For mounting liquid crystal displays and other high pin count or odd centered components Available in several sizes with bifurcated contacts in wire wrap pins or solder pin tails...
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 55mm Square FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications Any device pitch from 0.20mm 4-point crown insures “scrub” on...
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 14-27mm Square FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications Any device pitch from 0.20mm Pressure mounting, no soldering required...
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.20mm Pitch and Higher Up to 6.5mm Square FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications Any device pitch from 0.20mm Socket is easily mounted and...
High-Frequency Center Probe™ Test Socket for Devices up to 40mm Square FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any device pitch from 0.20mm 4 Point crown insures scrub on solder oxides Single-point Probes...
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 40mm Square FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any device pitch from 0.20mm 4-point crown insures “scrub” on solder oxides Single Point Probes...
High-Frequency Center Probe™ Test Socket w/Adjustable Pressure Pad for Devices up to 27mm Square FEATURES For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any device pitch from 0.20mm Pressure mounting, no soldering required 4 Point crown (other...
High-Frequency Center Probe™ Test Socket for Devices up to 13mm Square FEATURES For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any device pitch from 0.20mm Socket is easily mounted and removed to & from...
High-Frequency Center Probe™ Test Socket for Devices up to 6.5mm Square FEATURES For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any pitch device from 0.20mm Socket is easily mounted and removed to & from...
Elevated Display Socket with Collet Contacts on 0.300" [7.62mm] and 0.600" [15.24mm] Centers – Series 8XXX FEATURES Ideal for elevating devices (displays, switches, etc.) to desired level with 0.240 to 1.250 [6.10 to 31.75] height extension GENERAL SPECIFICATIONS STANDARD SOCKET BODY: Spacer black UL 94V-0 glass-filled...
Elevator Sockets with Bifurcated Contacts – Series 8XXX FEATURES Ideal for elevating devices (displays, switches, etc.) to desired level with 0.260 to 1.250 [6.60 to 31.75] height extension GENERAL SPECIFICATIONS STANDARD SOCKET BODY: black UL 94V-0 glass-filled 4/6...
Elevated Display Socket with Collect Contacts on 0.200" [5.08mm] Centers – Series 8XXX FEATURES Ideal for elevating devices (displays, switches, etc.) to desired level with 0.285 to 1.250 [7.24 to 31.75] height extension GENERAL SPECIFICATIONS STANDARD SOCKET BODY: and Spacer black UL 94V-0...
Series 6621 Inverter Socket FEATURES Inverted configuration allows the socket to be wave soldered on the component side of the PCB and the device socketed through a window on the solder side of the...
Kelvin Test Socket
Kelvin Test Socket
FEATURES Low resistance testing using dual independent Aries Kelvin spring-probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices Socket is easily mounted and removed...
Low-Profile Collet DIP Socket with Solder Tail Pins – Series 513 FEATURES Low-Profile Collet Sockets with Solder Pin Tails For Wire Wrap Pins, see Data Sheet 12012 Choose from several size and plating options GENERAL SPECIFICATIONS BODY MATERIAL: black UL 94V-0...
Low-Profile Collet DIP Socket with Wire Wrap Pins – Series 503 FEATURES Low-Profile Collet Sockets with Wire Wrap Pins For Solder Pin Tails, consult Data Sheet 12011 Choose from several sizes and plating options GENERAL SPECIFICATIONS BODY MATERIAL: black UL 94V-0...
Open-Frame Collet DIP Solder Pin Tail Sockets – Series 518 FEATURES Open Frame allows efficient utilization of board space with optimized cooling Choose from several pin styles Compatible with automatic insertion equipment Side-to-side and end-to-end stackable GENERAL SPECIFICATIONS BODY MATERIAL:...
Open-Frame Collet DIP Sockets with Wire Wrap Pins – Series 508 FEATURES Open-frame allows for more efficient utilization of board space and better cooling 2- and 3-level wire wrap pins available Compatible with automatic insertion equipment Side-to-side and end-to-end stackable GENERAL...
Surface Mount Open Frame Collet Sockets – Series 518 FEATURES Open-frame allows for more efficient utilization of board space and better cooling Compatible with automatic insertion equipment Side-to-side and end-to-end stackable GENERAL SPECIFICATIONS BODY MATERIAL: black UL 94V-0 glass-filled...
Pin-Line™ Headers – Series 0625 FEATURES Pin-Line™ Headers are available with a variety of screw machined contacts For Strip-Line™ Headers with coined contacts, consult Data Sheet 12034 Break feature allows header to be cut to...
High-Frequency (RF) Interposer Socket FEATURES Pressure-mount plunge to board interposer Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more Very low inductance per contact site High cycle life with easy maintenance Manual...
Pin-Line™ Collet Socket with Solder Tail Pin Tails – Series 0513 FEATURES Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for 0.100 [2.54] grid or matrix patterns Available with solder pin tails or...
Pin-Line™ Collet Socket with Wire Wrap Pins – Series 0503 FEATURES Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for 0.100 [2.54] grid or matrix patterns Available with wire wrap or solder...
Machined High-Frequency Center Probe™ Test Socket for BGA, CSP & MLF Packages FEATURES Solderless Spring-Probes pressure mount to the test board and device solder ball or pad Only 0.077 [1.96] signal path Very low inductance and capacitance Small footprint allows max. use...
Standard DIP Sockets – Series 501
Standard DIP Sockets – Series 511
FEATURES Standard DIP Sockets are available with Solder Pin Tails or Wire Wrap Pins, both with bifurcated contacts Aries offers these standard DIP sockets in more sizes than any other...
Strip-Line™ Headers – Series 0600 FEATURES Strip-Line™ Headers are available with either fork or post style coined contacts For Pin-Line™ Headers with screw machine contacts, consult Data Sheet 12036 Break feature allows header to be...
Surface Mount Single and Dual Row Collet Sockets – Series X518 FEATURES Surface-mount collet sockets are available in single and dual row Break feature allows strips to be cut to the number of positions desired Compatible with automatic insertion equipment Side-to-side...
Universal DIP Test Socket Receptacle – Series 6556 FEATURES The Aries Universal Test Socket Receptacle is sturdy, open-frame and easily mounted to PC boards Allows for easy replacement of Aries and other manufacturers’ test sockets The threaded inserts...
Thrifty Model with Bifurcated Contacts – Series 800 and 822 Vertisocket™ FEATURES These low-cost DIP Sockets are recommended for high-volume vertical display mounting applications Useful for connection of board-to-board jumpers, DIP switches, and LED devices GENERAL SPECIFICATIONS STANDARD BODY MATERIAL: black...
P/N 1107741 Oscillator Socket FEATURES This 4-pin Oscillator Socket (in 14- and 8-position frames) accept standard oscillator packages Designed to be end-to-end or side-to-side stackable Machine insertable GENERAL SPECIFICATIONS BODY MATERIAL: black UL 94V-0...
Universal PLCC ZIF Test Socket – Live Bug Type – Series 537 FEATURES This Universal PLCC ZIF Test Socket takes seven sizes of PLCC footprints with Aries Insert Plates The PLCC is inserted ‘live bug’ (pins down) into the position over the...
High-Temp (up to 300°C) Universal DIP ZIF Burn-in & Test Sockets
High-Temperature Universal DIP ZIF Test Socket – Series X55X
FEATURES Universal Test socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 or 15.24] centers...
Quick-Release Universal DIP ZIF Test Socket – Series X57X FEATURES Universal ZIF DIP Test Socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 to...
RF Test Sockets w/Replaceable Contact Strips FEATURES User replaceable patented Microstrip™ contacts which lie flat on the DUT board, and become part of the transmission line decreasing down-time Same high-frequency performance of our standard Microstrip™ contacts...
High-Temp (up to 250°C) RF Test Socket with Replaceable Contact Strips FEATURES User replaceable patented Microstrip™ contacts which lie flat on the DUT board, and becomes part of the transmission line decreasing down-time Same high-frequency performance of our standard Microstrip™ contacts...
High-Temp (up to 200°C) CSP Burn-in & Test Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices or Any Custom Machined Configuration KEY PERFORMANCE ELEMENTS – Series AR4HT High-Temperature 200°C (high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing) Excellent Compliance (shorter than other low-profile contacts, enables...
Hi-Temp 200°C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices KEY PERFORMANCE ELEMENTS – Series AR4HT High-Temperature 200°C (high-frequency bandwidth, low inductance, high-current, reliable, durable) Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). Excellent choice...
CSP/µBGA Test & Burn-In Socket for Any Device Package on 0.2mm Pitch and Higher Up to 13mm Square CSP/µBGA Test & Burn-In Socket for Devices up to 13mm Square Chinese FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices. Consult factory for...
High-Frequency Center Probe™ Test Socket for Devices from 14 to 27mm Square High-Frequency Center Probe Test Socket for Devices up to 27mm Square Chinese FEATURES For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices Any device...