Thermoset Adhesives:

Thermoset adhesives are crosslinked polymeric resins that are cured using heat and/or heat and pressure. They are used for high load assemblies and in severe service conditions.
Thermoset Adhesives: Learn more

Product Name Notes
Chipbonder® Surface Mount Adhesive -- 3607
Chipbonder® Surface Mount Adhesive -- 3609
Chipbonder® Surface Mount Adhesive -- 3612
Chipbonder® Surface Mount Adhesive -- 3615
Chipbonder® Surface Mount Adhesive -- 3616
Chipbonder® Surface Mount Adhesive -- 3619
Chipbonder® Surface Mount Adhesive -- 3621
Chipbonder® Surface Mount Adhesive -- 3625
Chipbonder® Surface Mount Adhesive -- 3627
Chipbonder® Surface Mount Adhesive -- Cornerbond 3515
Designed for high speed printing and dispensing
Thermal Management Adhesive -- 315
Thermal Management Adhesive -- 3151
Thermal Management Adhesive -- 383
Thermal Management Adhesive -- 384
Thermal Management Adhesive -- 3872
Thermal Management Adhesive -- 3873
Thermal Management Adhesive -- 3874
Thermal Management Adhesive -- 5404
Thermal Management Adhesive -- 5405
Thermal Management Adhesive -- 5406
Thermal Management Adhesive -- 7387
Thermal Management Adhesive -- QMI 5030
Ease-of-use, thermal conductivity
Electrically Conductive Adhesive -- 3441
Electrically Conductive Adhesive -- 3447
Electrically Conductive Adhesive -- 3880
Electrically Conductive Adhesive -- 3882
Electrically Conductive Adhesive -- 3887
Electrically Conductive Adhesive -- 3888
Electrically Conductive Adhesive -- 3889
Electrically Conductive Adhesive -- 5420
Electrically Conductive Adhesive -- 5421
For bonding temperature sensitive components
Hysol® Semiconductor Encapsulant -- 3515
Hysol® Semiconductor Encapsulant -- 3594
Hysol® Semiconductor Encapsulant -- FP4527
Meets JEDEC level testing requirements, compatible with lead free testing
Circuit Board Protection -- 5699
Circuit Board Protection -- 5910
Circuit Board Protection -- ES6010
Superior environmental protection, extreme thermal cycling resistance
Hysol® Die Attach Adhesive -- KO0125
Hysol® Die Attach Adhesive -- QMI 2419
Hysol® Die Attach Adhesive -- QMI 2569
Hysol® Die Attach Adhesive -- QMI 282HT
Hysol® Die Attach Adhesive -- QMI 301
Hysol® Die Attach Adhesive -- QMI 3555R
Hysol® Die Attach Adhesive -- QMI 505MT
Hysol® Die Attach Adhesive -- QMI 518
Hysol® Die Attach Adhesive -- QMI 519
Hysol® Die Attach Adhesive -- QMI 519HT02
Hysol® Die Attach Adhesive -- QMI 534
Hysol® Die Attach Adhesive -- QMI 536
Hysol® Die Attach Adhesive -- QMI 536HT
Hysol® Die Attach Adhesive -- QMI 536UV
Hysol® Die Attach Adhesive -- QMI 538
Hysol® Die Attach Adhesive -- QMI 550
Hysol® Die Attach Adhesive -- QMI 550EC
Hysol® Die Attach Adhesive -- QMI 550SI
Withstands polymer decomposition during reflow