Entech Electronics China provides a comprehensive range of quality accredited contract manufacturing and product assembly services to the International electronics industry. Our in-house and contract partners include the following capabilities:
Component Procurement & Management Service
· Domestic and International supply lines.
· Procurement teams in Shenzhen and Australia.
· Customs arrangements and documentation for importation of client supplied components (FIA) available.
· Sourcing of wire looms, including over moulds and semi rigid moulding, all custom and commodity cables.
· Metal fabrication, casting and extrusion, including all finishes and pad printing.
· Plastics tooling and manufacture.
· Entech partners with 4 assembly facilities as well as in-house capabilities to provide any volume requirement.
· Lead free processing.
· Through Hole Assembly Lines.
· Dual Wave, Wave Soldering machine.
· Fine Pitch QFP to .02" (0.5mm).
· BGA to .01" (0.3mm).
· Chip components 0201.
· PCB size 1.18"-20" (30-510mm).
· Mixed technology assembly.
· Mechanical and box build assembly.
· MDA (Bed of Nails using HP3065 & HP3070).
· Full functional testing using dedicated Jigs and fixtures.
· Functional testing (Teradyne A360, Geotester).
· X-Ray and Optical inspection facility for BGA placement.
· PC based test systems (Dedicated, JTAG/Boundary Scan).
Turnkey product manufacturing
· Total product build.
· Packaging and warehousing including manuals, CDs, literature and cartons.
· Shipping direct to the end user.
· Design advice on suitability for manufacture (DFM).
· Engineering support including PCB layouts and design.
· Production tooling and test jig design and manufacture.