Indium Corporation Engineered Solder Materials AuSn Preforms for Die-Attach Application

Indalloy® 182 (80Au/20Sn) has a melting point of 280°C (556°F). It can be made into solder preforms with various options to address specific applications. Gold-tin solder preforms are generally used in applications that require a high melting temperature (over 150°C), good thermal fatigue properties, and high temperature strength. It is also used in applications that require high tensile strength and high corrosive resistance, or in step soldering applications where the preform will not melt during a subsequent low-temperature reflow process. This alloy is suitable for fluxless soldering as well. For these reasons, Indalloy® 182 solder preforms are an obvious choice for die bonding applications. The inherent attributes of AuSn alloys are preferable for high power die. However, some attributes must be engineered into the preform in order to optimize performance.