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Thermal -- H77 -- View Larger Image
Thermal -- H77-Image

Product Description:
EPO-TEK® H77 is a two component, thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic.
EPO-TEK® H77 Advantages & Application Notes:
 High temperature epoxy. Coatings on metals have been subjected to temperatures as high as 260°C without bond failure; can also resist >300°C processes found in ceramic or hermetic packaging.
 Rheology provides a soft, smooth, flowing paste with excellent handling characteristics; low viscosity allows it to be poured or cast into shape for potting applications; compatible with automated dispense equipment, screen printing, or stamping techniques.
 Available in smaller particle size, if needed. Also available in higher viscosity for better non-flow properties. Contact techserv@epotek.com for your best match.
 Excellent solvent and chemical resistance - ideal for harsh environments found in aircraft, under-hood automotive, medical, and petrochemical refineries such as down-hole applications.
 Can provide near hermetic seals in the packaging of MEMs devices, like pressure sensors or accelerometers, packaged in TO-cans.
 Passes NASA low outgassing standard ASTM E595 with proper cure - http://outgassing.nasa.gov/
 Suggested for ultra-high vacuum applications.
 It can also be used for sealing of optical filter windows found in scientific OEM or sensor devices.



Product Category
Industrial Adhesives
Material System
Chemical System
Epoxy
Composition
Filled
Cure / Technology
Thermoset; Two Component  
Composition & Features
Features
High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
Substrate Compatibility
Metal; Plastic

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Material Properties (Nominal / Typical)
Viscosity
 
Use Temperature
 
Thermal Conductivity
 
CTE
 
Dielectric Constant
 

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