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EPO-TEK® H77 is a two component, thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic.
EPO-TEK® H77 Advantages & Application Notes:
High temperature epoxy. Coatings on metals have been subjected to temperatures as high as 260°C without bond failure; can also resist >300°C processes found in ceramic or hermetic packaging.
Rheology provides a soft, smooth, flowing paste with excellent handling characteristics; low viscosity allows it to be poured or cast into shape for potting applications; compatible with automated dispense equipment, screen printing, or stamping techniques.
Available in smaller particle size, if needed. Also available in higher viscosity for better non-flow properties. Contact email@example.com for your best match.
Excellent solvent and chemical resistance - ideal for harsh environments found in aircraft, under-hood automotive, medical, and petrochemical refineries such as down-hole applications.
Can provide near hermetic seals in the packaging of MEMs devices, like pressure sensors or accelerometers, packaged in TO-cans.
Passes NASA low outgassing standard ASTM E595 with proper cure - http://outgassing.nasa.gov/
Suggested for ultra-high vacuum applications.
It can also be used for sealing of optical filter windows found in scientific OEM or sensor devices.